Quad Ethernet 10GBASE-T PHY Targets Top-of-Rack Switches

Thank you for recommending “”. Your recommendation has been successfully processed. Date Posted: November 12, 2012 03:13 PM While 1-Gbit/s Ethernet is everywhere, the 10-Gbit/s version is slowly ramping up now that low-power chip designs have become available. As the data volume continues to increase in data centers, there’s growing pressure to add more 10G capability. That means more …

Package Interconnects Can Make Or Break Performance

Chip and package designers can select from a bewildering catalog of interconnect technologies. Interconnects between the die and package include traditional wire-bond and flip-chip solder bumps, flip-chip gold-to-gold and copper pillar technologies, and embedded technologies like embedded wafer-level ball-grid array (eWLB). Within a package, die can be side-by-side, stacked, flipped piggyback on each other, or interconnected with the latest chip-to-chip …